A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting

Abstract

The reaction of appropriate copper and vanadium salts with tetratopic methane tetra-p-phenylphosphonic acid (MTPPA) in the presence of 2,2':6':2 ''-terpyridine (terpy) yielded the three-dimensional bimetallic copper vanadium phosphonate framework [{Cu(terpy)}(4)Cu(VO2)(4)(MTPPA-H)(2)]center dot 4H(2)O (1). Terpy has no net contribution to the three-dimensional structure providing a potential platform for void space formation via mold-casting. The structure was characterized by single-crystal X-ray diffraction and thermogravimetric analysis (TGA). Magnetic measurements were performed using a SQUID magnetometer. The crystal structure of the methanol solvate of the free ligand, MTPPA center dot MeOH, was analysed using Hirshfeld surfaces and fingerprint plots.